Robotics, Automation & AI
APIE 2027
Asia-Pacific International Intelligent Equipment Exposition
亚太国际智能装备博览会
Dates
UPCOMING
14–17 Jul 2027
Venue
Hongdao International Conference & Exhibition Center
Exhibition area
130,000+ m²
Visitors (expected)
150,000+
About the show
APIE, Asia-Pacific International Intelligent Equipment Exposition, is a trade fair for industrial automation and intelligent manufacturing equipment. Industrial automation and control sit at the centre of the programme, with robotics, logistics equipment, power transmission and embodied intelligence — the field that puts artificial intelligence to work in machines that move and act in the physical world — arranged around them, so that a visitor can follow the chain from components through to a complete production solution.
The show is held in Qingdao, whose industrial base runs through home appliances, rail transit, shipbuilding and marine engineering, and whose position on the Yellow Sea facing Japan and Korea gives the fair its Asia-Pacific reach. Visitors come from Shandong and the wider Bohai Rim as well as from Japan and Korea; the suppliers who equip their plants are in the same halls, and the fair also stages technology forums and cross-border procurement matchmaking.
What’s on display
Industrial automation
- Industrial automation and control systems: assembly and handling systems, linear positioning, fieldbus and industrial networks, distributed and embedded I/O, industrial PCs, switches, PLCs and human-machine interfaces
- Electrical systems: servo and stepper motors, drives, inverters, motion controllers and control cards, linear and torque motors, CNC systems, switches, indicators, relays, industrial power supplies and enclosures
- Robotics and machine vision: industrial robots and system integration, collaborative and mobile robots, manipulators, tool changers and reducers; 3D and 2D vision, smart cameras, industrial lenses, lighting, image-processing software, vision inspection and optical sorting machines
- Sensing, connection and power transmission: sensors, connectors, terminal blocks, wiring accessories, safety devices, interface modules, cables, harnesses and instruments; motors, reducers, bearings, pneumatics, hydraulics, sealing, belt, chain and rack-and-pinion drives, linear modules, electric cylinders, guide rails, ball screws, compressors and vacuum technology
- Factory automation: automated equipment and production lines, system integration, automated warehousing and packaging, industrial assembly, smart factory solutions, flexible production lines, industrial IoT and laser technology
- Automation for electronics production: harness and cable automation, dispensing, screw-driving, terminal and wire-stripping machines, winding machines, test and measurement, soldering equipment and materials, barcode equipment, SMT technology and electronic assembly automation
Robotics
- Robot system integration: solutions for automotive assembly and parts, new energy, 3C and electronics, machine tools, home appliances, biopharmaceuticals, food, packaging, logistics and warehousing; robot workstations, robot and automation systems, and intelligent robot production lines
- Collaborative robots: explosion-proof, single-arm, dual-arm, seven-axis, six-axis and sub-six-axis, heavy-payload, light-payload and desktop collaborative robots, and assist manipulators
- Mobile robots: roller, towing, lifting, picking, hybrid, omnidirectional, vision-guided, laser-guided, inertial-guided and electromagnetic-guided mobile robots; drones; smart warehousing management and robot material-handling systems; automated logistics equipment and integrated conveying systems
- Machine vision: 3D and 2D vision, smart cameras, industrial lenses, lighting, vision components, image-processing software, vision inspection equipment, optical sorting machines, code readers, scanners and printers
- Industrial robots: welding, painting, palletising, handling, assembly, laser-processing, vacuum, cleanroom and grinding and polishing robots; articulated, SCARA, delta and Cartesian robots
- Core components: controllers, reducers, servo motors, sensors, dedicated cables, manipulators and grippers, tool changers and related components
Logistics equipment
- Robots and AGV/AMR: L4 driverless tractors, flatbed trucks, forklifts and transfer vehicles for plants and industrial parks; autonomous dispatch platforms, vehicle-road cooperation systems and driverless logistics solutions
- Warehousing and workshop equipment: automated storage and retrieval systems, four-way shuttle systems, racking, mini-load stackers, high-speed storage, workstation logistics equipment, loading docks, industrial doors, and warehouse cleaning and protective equipment
- Industrial vehicles and lifting: forklifts and their components, cranes and their components, lift platforms, dock levellers, pallet trucks, charging stations, batteries, motors, tail lifts, and hydraulic and pneumatic drive components
- Conveying, sorting, packaging and weighing: conveyors, lifts, flexible conveying systems, sorters, auxiliary sorting devices, detection and sensing equipment, belts, rollers, chains and sprockets, idlers, tensioners, couplings and sorting drive motors; automated packaging and weighing equipment, load cells, control systems and measuring technology
- Logistics packaging units and consumables: pallets, turnover boxes, stretch film, FIBCs, strapping, castors, returnable packaging and packing consumables
- Material handling and system integration: handling equipment, overhead cranes, electric hoists and winches; system integration and supply-chain solutions; warehouse management, warehouse control and material-flow software, and data-capture and digitalisation tools
Power transmission and control
- Electrical drives: general-purpose and special industrial motors, servo motors, small motors, variable-frequency drives and converters, electric drive control systems and governors, and electromagnetic equipment
- Bearings: bearing components, bearing production and processing machinery, and related equipment and accessories
- Linear motion systems: linear modules with ball screws or timing belts, linear slides, linear guides, lifting units and elevators, guide shafts and supports, linear actuators, electric and electro-hydraulic cylinders, ball screws and rack drives
- Mechanical transmission and components: gear, chain and belt drives, couplings, springs, metallurgical products, machinery and testing instruments
- Fluid power: hydraulics, pneumatics and sealing technology
Semiconductor technology and applications
- IC design and applications: embedded processors, sensor chips, automotive-grade chips, memory, security chips, power management chips, communication chips, AI and computing chips, EDA tools and IP cores
- Advanced packaging and testing: Chiplet, 2.5D/3D, SiP, WLP/FOPLP and TSV/RDL packaging; IGBT, SiC and GaN power module packaging, silver sintering, precision bonding and wafer processing; packaging substrates and materials; wafer and final testing, power-parameter and reliability testing, non-destructive inspection and packaging-and-testing services
- Power semiconductors and electronic components: IGBTs, MOSFETs, thyristors, fast-recovery diodes, SiC and GaN devices, power management ICs and gate drivers; power capacitors, inductors, transformers, reactors, sampling resistors, Hall current sensors, relays, fuses, connectors, DBC ceramic substrates and discrete and passive components
- Semiconductor materials, consumables and chemicals: silicon wafers and silicon-based materials, photomasks, electronic gases, photoresists and ancillary chemicals, CMP polishing materials, targets, lead frames, bonding wires, packaging materials and ceramic substrates
- Compound and third-generation semiconductors: compound semiconductors, SiC and GaN substrates, epitaxial wafers, coating materials, SiC and GaN devices, power electronic devices and microwave and RF devices
- Semiconductor manufacturing: lithography, coater-developer, etching, CVD/PVD, ion implantation, rapid thermal processing, polishing, cleaning, thinning, dicing, die-bonding, wire-bonding, crystal-growing and grinding equipment and core components; wafer fabrication from crystal growth and wafer slicing through precision polishing, CD metrology and overlay and flatness inspection
- Optoelectronic technology: optical communication devices and modules, photodetectors, fibre-optic components, optoelectronic devices, infrared devices, display panels, automotive displays, AR/VR optical modules, optical lenses and photoelectric testing equipment
Embodied intelligence
- AI applications: manufacturing and energy, healthcare and rehabilitation robots, education, finance, transport including vehicle-road cooperation and autonomous driving, urban governance, retail, culture and digital entertainment, smart homes, AI offices and smart cockpits; bionic robots, brain-computer interfaces, and quantum computing and robotics
- Whole-machine development and production: design and system integration; production equipment, lines and contract manufacturing; testing; lifecycle services covering inspection, repair and maintenance; and robot processing equipment, tools, testing equipment and instruments
- Core technologies behind the robot “brain”: data acquisition and devices, data standards and platforms, perception solutions and algorithm suppliers, simulation tools and modelling, software systems and infrastructure, computing chips and platforms, storage chips, edge-computing devices, cloud services and IoT components
- Robot core components: servo and transmission systems, sensors, control systems, actuators including dexterous hands and fixtures, integrated joint modules, mobile-base power systems, transmission and connection systems, and key materials
- Robots and solutions: humanoid, industrial, special-purpose and service robots, and their solutions for industry, healthcare, commerce, emergency response, elderly care and education
Reference
Concurrent shows
The exposition is organised as six themed zones, and several of them are shows in their own right: the Qingdao industrial automation show (IAIE), a humanoid robotics and embodied-intelligence congress with its own industry-chain exhibition, the Qingdao logistics equipment show, the Qingdao power transmission and control show (IPCE), and an Asia-Pacific semiconductor technology and applications show.
Concurrent programme
The China-Japan-Korea Intelligent Manufacturing Conference runs with the show, alongside a programme of high-level industry and technology forums, cross-border procurement matchmaking meetings, a buyers’ reception, and online matchmaking through the organiser’s live-streaming platform.
Visitor profile
Buyer delegations are invited from automotive equipment, 3C electronics, rail transit, petrochemicals and biopharmaceuticals, together with new energy, machinery manufacturing, home appliances, metallurgy and casting, environmental equipment, and packaging and printing.
Practical information
Organizers
Qingdao JINNOC International Exhibition Co., Ltd.Shandong Nuozhan International Exhibition Co., Ltd.
Visiting address
Hongdao International Conference & Exhibition CenterNo. 326 Huoju Road, High-tech Zone, Qingdao