Electrical, Electronics & Semiconductors
HKPCA Show 2026
International Electronics Circuit Exhibition (Shenzhen)
国际电子电路（深圳）展览会
Dates
UPCOMING
2–4 Dec 2026
Venue
Shenzhen World Exhibition & Convention Center
Exhibition area
90,000 m²
Booths (expected)
4,400+
About the show
International Electronics Circuit Exhibition (Shenzhen) serves the printed circuit board and electronics assembly industry, bringing materials, chemicals, equipment and finished boards together in one venue. The aisles are built around the fabrication process itself, from CAD/CAM and imaging through drilling, plating, lamination and surface finishing to electrical test and reliability screening.
Around that core sit the technologies that now decide a board shop’s yield: AOI and AVI inspection, intelligent logistics and production software, packaging and test for IC substrates and advanced packages. A parallel assembly section covers stencil printing, placement, reflow, wire bonding and rework, so visitors can follow a board from raw laminate to a populated module without leaving the hall.
What’s on display
PCB applications
- Automotive
- Communications equipment
- Computers and computer peripherals
- Consumer electronics
- Military and aerospace
- Industrial, medical and application software
Printed circuit boards
- Connector PCBs
- High-density interconnect (HDI) boards
- IC substrates (BGA, CSP, flip chip)
- Rigid single-sided boards
- Rigid double-sided and multilayer boards
- Rigid-flex boards
- Flexible printed circuits
PCB and intelligent automation equipment
- PCB CAD/CAM systems
- Pre-production preparation
- Inner and outer layer imaging and circuit design
- Lamination
- CNC mechanical drilling
- CNC high-density laser drilling
- Electrolytic and electroless plating
- Automated operation and robotics
- Profiling and routing
- AOI, AVI and PCB inspection
- Surface treatment and finishing
- Solder mask printing
- Electrical testing
- Reliability and engineering testing
- Environmental protection engineering and procedures
- Packaging processes
Environmental and cleanroom technology
- Clean production technology and equipment
- Water treatment and recycling
- Cleanroom technology and equipment
- Waste recycling systems
- Cleaning systems and equipment
- Fume treatment and exhaust systems
PCB materials and chemicals
- Thin-film circuit design and related chemicals
- Resin systems and laminates
- Glass fibre cloth, fabrics and carbon fibre
- Copper foil
- CNC drill bits
- Dry film and liquid photoresists
- Copper, tin and gold plating chemistries
- Surface treatment chemicals
- Screen printing and photoimageable solder masks
- Inks
- Copper and other anodes
Electronics assembly
- Design, consultancy and testing services
- Contract manufacturing services
- REACH/RoHS compliance services
- CAD/CAE/CAM systems
- Components, connectors and fasteners
- Stencil printing equipment
- Component preparation and placement equipment
- Assembly equipment
- Dispensing equipment
- Reflow soldering equipment
- Cleaning equipment
- Hand soldering processes, chemicals and equipment
- Wire bonding equipment
- Test, measurement and inspection equipment
- Rework and repair equipment
- Drilling, routing and machining equipment
Intelligent manufacturing
- Industrial AI models
- AI software and applications
- Industrial, embodied, humanoid and collaborative robots
- Smart PCB production solutions
- Intelligent logistics and warehousing systems
- Industrial IoT technology
- Production management software (ERP/MES/CRM/SCM/QMS/WMS)
- Sensors, servo motors, drives, reducers and measuring instruments
Packaging and test technology
- IC packaging technology
- IC test technology
- Semiconductor packaging technology
- Semiconductor test technology
- Advanced packaging technology
Precision parts and components
- Controllers
- Connectors
- Switches
- Lasers
- Optical lenses
- Pumps, valves and fittings
- Mechanical parts
Reference
Theme
The 2026 edition is built around AI-driven technology, with the floor and conference sessions weighted towards HDI, IC substrates, advanced packaging substrates and high-speed materials used in AI hardware, plus AI-assisted inspection and production scheduling.
Visitor profile
Board makers, materials and chemical suppliers, equipment builders, electronics manufacturing services and contract manufacturers, automation suppliers, plating and chemical firms, computer and telecom companies, and precision component and packaging specialists.
Practical information
Organizer
Hong Kong Printed Circuit Association
Opening hours
10:00–17:00 on 2 December, 09:00–17:00 on 3 December and 09:00–16:00 on 4 December
Visiting address
Shenzhen World Exhibition & Convention CenterNo. 1 Zhancheng Road, Fuhai Street, Bao’an District, Shenzhen