Shanghai International Precision Ceramics and Power Semiconductor Exhibition follows the ceramic end of the electronics supply chain: the powders, tapes and substrates that go into a package, and the metallisation, plating and sintering steps that turn them into a finished part.

Its halls run from ceramic devices and precision components through substrates, packages and metal pastes to the furnaces, presses, laser machines and inspection systems that process them. A second section is given to power semiconductors, covering silicon carbide, ceramic liners, die attach, wire bonding, encapsulation and power cycling test.