Electrical, Electronics & Semiconductors

CWIC 2026

China Western Semiconductor and Integrated Circuit Industry Expo

中国西部半导体及集成电路产业博览会

Dates
COMPLETED
3–5 Sep 2026
Venue
Xi’an International Convention and Exhibition Center

About the show

China Western Semiconductor and Integrated Circuit Industry Expo covers the semiconductor supply chain from design and fabrication through packaging and testing, together with the materials and production equipment behind each step. It is held in Xi’an, the centre of Shaanxi’s semiconductor industry, where more than 200 semiconductor companies and research institutes work across the full chain, from equipment and materials to design, fabrication, packaging, testing and system application.

The floor runs the whole chain rather than one segment: design tools and IP, foundry capacity, packaging and test, and the materials and equipment that feed them. That breadth matches the region’s build-out in third-generation semiconductors, advanced packaging, chiplets, high-performance computing, AI chips, automotive electronics and satellite applications.

What’s on display

IC design

  • EDA
  • IP design
  • Embedded software
  • Digital circuit design
  • Analogue and mixed-signal circuit design
  • IC layout design

IC manufacturing

  • Wafer fabs
  • Foundries
  • Analogue ICs
  • Digital ICs
  • Mixed-signal ICs

Packaging and testing

  • Probe stations
  • Test systems
  • Test handlers
  • Packaging equipment

Semiconductor materials

  • Silicon wafers and silicon-based materials
  • Photomasks
  • Electronic gases
  • Photoresists and ancillary chemicals
  • CMP polishing materials
  • Sputtering targets
  • Packaging substrates
  • Lead frames
  • Bonding wire
  • Encapsulation materials
  • Ceramic substrates
  • Die-attach materials

Production equipment

  • Wafer thinning machines
  • Crystal growing furnaces
  • Lapping and grinding machines
  • Thermal processing equipment
  • Lithography systems
  • Etch systems
  • Ion implanters
  • CVD and PVD equipment
  • Cleaning equipment
  • Dicing machines
  • Die bonders
  • Wire bonders

Reference

Co-located show
The expo runs alongside the China (Xi’an) Electronic Information Industry Expo, which covers electronic components, new displays, test and measurement, big data and artificial intelligence, smart manufacturing and industrial internet, 5G and smart terminals, connected vehicles, and pavilions for government bodies and industrial parks.
Conference programme
A high-level forum, technical seminars and investment matchmaking are held alongside the exhibition, including a forum on integrating the industrial and innovation chains.
Supporting associations
Provincial and municipal semiconductor associations from across China co-organise the expo, among them those of Shaanxi, Anhui, Jiangsu, Zhejiang, Shanghai, Chongqing, Tianjin, Dalian, Shenzhen and Chengdu.

Practical information

Organizer
Xi’an Chanba Ecological District Administrative Committee
Visiting address
Xi’an International Convention and Exhibition CenterNo. 1399 Huizhan 1st Road, Baqiao District, Xi’an

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