Electrical, Electronics & Semiconductors
Shenzhen International Data Center Liquid Cooling Technology Exhibition 2027
深圳国际数据中心液冷产业展览会
Dates
UPCOMING
16–18 Jun 2027
Venue
Shenzhen World Exhibition & Convention Center
Exhibition area
60,000 m²
Exhibitors (expected)
1,000+
About the show
Shenzhen International Data Center Liquid Cooling Technology Exhibition follows the heat path of a data centre from rack to plant. Cold plates, CDUs, manifolds, pumps, couplings, hoses and heat exchangers carry the heat off a server, the fluids and leak detection instruments keep the loop sealed, and cooling towers and heat rejection equipment close it at the other end.
Server, chip and infrastructure suppliers exhibit alongside component makers, and the buyer side is made up of the operators, cloud providers, EPC contractors and system integrators that specify and run sites.
What’s on display
AI computing and algorithms
- Infrastructure servers and storage
- Network equipment
- Optical communication and transmission
- AI chips, DPUs, CPUs and GPUs
- Memory chips
- Edge computing chips
- Edge computing
- Supercomputing, intelligent computing and edge data centres
- Cloud services
- Internet of Things
- Computing security
- Software applications
Data centre infrastructure
- Data centre infrastructure solutions
- Edge data centre solutions
- Micro-modular data centres
- Air conditioning, refrigeration and fresh air systems
- Power supply and distribution systems
- Structured cabling
- Computer room construction and decoration materials
- Large-screen display systems
- Fire protection systems
- Security systems
Cooling fluids and raw materials
- Coolants
- Refrigerants
- Fluorinated liquids
- Silicone oils
- Mineral oils
- Carbon dioxide and hydrogen
- Aqueous solutions
Liquid cooling equipment
- Cold plate cooling products
- Metal cold plates
- Heat-generating equipment and components
- Liquid circulation equipment
- Immersion cooling products
- Heat sinks
- Radiators
- Heat pipes
- Fans
- Pumps
- Compressors
- Drive and power components
- Temperature control modules
- Thermostats and temperature controllers
- Temperature sensors
- Evaporators
- Condensers
- Expansion tanks and coolant reservoirs
Pipes and connectors
- Rubber hoses
- Metal pipes
- Corrugated pipes
- Insulated pipes
- Water pipes and fittings
- Cooling lines and connecting components
Auxiliary cooling equipment
- Cooling fans
- Thermal materials
- Enhanced radiators
- Ambient air exchange equipment
Liquid cooling technologies
- Cold plate liquid cooling, including all-liquid cold plate servers
- Immersion liquid cooling, single- and two-phase
- Spray liquid cooling
- Decoupled cold module design
- Intelligent temperature control systems
- Fluid distribution technology
- Coolants such as fluorinated liquids and mineral oils
- Cold plates
- Pumps
- Valves
- Quick couplings
- Heat exchangers
- Leak detection equipment
- Smart sensors
- Phase change materials (PCM)
Reference
Co-located events
The fair runs in the same halls as two other shows: one on AI computing infrastructure, the other the 18th edition of a thermal management and heat dissipation materials exhibition. The three run on the same dates at the same venue.
Past edition
The 2026 edition drew 874 exhibitors and 51,065 trade visitors across 40,000 m² of floor space.
Visitor profile
Buyers come from data centre and cloud operations, telecoms, power and energy, electronics and semiconductor manufacturing, automotive, aerospace and medical users, alongside the high-performance computing, edge computing and artificial intelligence clusters behind them. The organiser also invites more than 800 hosted buyers to the floor.
Practical information
Organizer
Bohan Exhibition (Shenzhen) Co., Ltd.
Visiting address
Shenzhen World Exhibition & Convention CenterNo. 1 Zhancheng Road, Fuhai Street, Bao’an District, Shenzhen