Electrical, Electronics & Semiconductors
Shanghai International Semiconductor Technology Conference and Exhibition 2027
上海国际半导体技术大会暨展览会
Dates
UPCOMING
16–18 Jun 2027
Venue
National Exhibition and Convention Center (Shanghai)
Exhibition area
60,000 m²
Exhibiting brands (expected)
1,200
About the show
Shanghai International Semiconductor Technology Conference and Exhibition covers the semiconductor supply chain end to end: wafer fabrication, packaging and test, compound semiconductors, components, EDA and design services, and automotive semiconductors. Six exhibition zones follow that order, so a visitor can move from process equipment and materials through to finished automotive-grade devices without leaving the hall.
A conference runs alongside the floor. The event is pitched at the IC design and application base that has grown up in Shanghai, and at the equipment, materials and service suppliers who serve fabs and OSATs across East China.
What’s on display
Wafer fabrication
- Wafer processing equipment and plant facilities
- Wafer processing materials
- Subsystems, components and indirect consumables
Packaging and test
- Packaging and test equipment
- Packaging and test materials
- Subsystems, components and indirect consumables
Compound semiconductors
- Silicon carbide (SiC), gallium nitride (GaN) and gallium arsenide (GaAs) materials
- RF and high-power semiconductors
- Power devices for new energy applications
Components
- Process components and structural components
- Modules, gas lines and RF power supplies
- Optics, vacuum systems, sensors and instrumentation
EDA, IP and design services
- Electronic design automation (EDA) software and services
- Process control and process software
- Chip design IP and services
- Chiplet design and consulting
- 2.5D/3D advanced packaging design and consulting
- AI and cloud design platforms and services
- Other design services
Automotive semiconductors
- Automotive-grade power semiconductors including IGBT, SiC and GaN
- Automotive MCUs, ECUs and domain controllers
- Smart cockpit, ADAS and autonomous driving chips and systems
- Automotive memory and high-performance computing chips (AI, GPU, CPU)
- Automotive safety, telematics and connected-car chips, modules and systems
Reference
Concurrent programme
Fifty sessions are scheduled alongside the exhibition, built around a main forum plus project roadshows, technology presentations and an awards session.
Practical information
Visiting address
National Exhibition and Convention Center (Shanghai)No. 333 Songze Avenue, Qingpu District, Shanghai