Electrical, Electronics & Semiconductors
IC Expo 2026
China (Shanghai) International Semiconductor Industry and Application Expo
中国先进半导体产业与应用博览会
Dates
UPCOMING
10–12 Nov 2026
Venue
Shanghai New International Expo Centre
About the show
The chain is on the floor at IC Expo, in sequence: circuit design and wafer fabrication, advanced packaging and test, and the equipment, materials and components each stage runs on. Power devices, automotive semiconductors, memory and co-packaged optics sit at the application end of the same floor.
Its visitors come mostly from the Yangtze River Delta, where design houses, foundries, packaging plants and equipment builders sit close together: process engineers, packaging and test specialists, procurement teams, and the systems houses that buy their output for communications, computing, automotive, industrial control and medical equipment.
What’s on display
Chip design and wafer fabrication
- Integrated circuit design and chips
- EDA tools
- MCU microcontrollers
- Wafer fabrication
Wafer fabrication equipment and components
- Wafer thinning machines
- Single-crystal furnaces
- Grinding machines
- Heat treatment equipment
- Lithography systems
- Etch systems
- Ion implantation equipment
- CVD and PVD systems
- Cleaning equipment
- Dicing machines
- Die bonders
- Wire bonders
- Testers
- Sorters
- Probe stations
- Equipment components and parts
Advanced packaging
- Chiplet
- SiP packaging
- Wafer-level packaging (WLP)
- 3D packaging
- Panel-level packaging (PLP)
- TSV and TGV packaging
- Organic, silicon and glass substrates
- Package substrates
- Package carriers
- IC substrates
- Packaging materials
- Packaging equipment
Advanced materials
- Silicon wafers and silicon-based materials
- Photomasks
- Electronic gases
- Photoresists and ancillary chemicals
- CMP polishing materials
- Sputtering targets
- Lead frames
- Bonding wires
- Ceramic substrates
- Die attach materials
- Carbon-based materials
- Diamond semiconductors
- Graphite materials
- Superhard materials
Compound and third-generation semiconductors
- Gallium nitride (GaN)
- Silicon carbide (SiC)
- Zinc oxide (ZnO)
- Diamond
- Wafers
- Substrates and epitaxy
- Power devices
- IGBT packaging materials
- RF devices
- Processing equipment
Power devices and automotive semiconductors
- Automotive-grade control and computing chips
- Power semiconductors (IGBT and MOSFET)
- Automotive-grade SiC modules
- Power management ICs
- Automotive electronics micro-assembly and power devices
- Packaging and test equipment
- Automation equipment
- Instruments and components
Computing, memory, AI and co-packaged optics
- AI chips and solutions
- Computing chips and solutions
- Algorithm solutions
- Data storage
- Co-packaged optics modules, technology and equipment
Displays and application solutions
- OLED and AMOLED
- Mini and Micro LED
- Silicon-based displays
- Flexible display technology
- Automotive electronics
- Special electronic systems
- 5G, AI and IoT applications
- Internet of Things
- Motor drives
- Industrial control
Reference
Same roof
The show runs alongside the China Electronic Fair, which covers components and electronics, on the same dates at the same venue.
Past edition
When the two shows ran together in November 2025, the combined floor listed more than 600 exhibitors, and the opening day alone drew over 10,000 trade visitors.
Visitor profile
Buyers come from communications, computers and peripherals, security, automotive electronics, consumer electronics, industrial control and automation, aerospace, medical equipment, lighting and display, new energy and rail transit. More than half of them work in procurement or R&D.
Practical information
Organizer
China Electronics Appliance Corporation
Admission
Trade visitors only; free badge on presentation of a business card. Online pre-registration closes on 1 November 2026.
Opening hours
10–11 November 09:00–17:00; 12 November 09:00–15:00
Visiting address
Shanghai New International Expo CentreNo. 2345 Longyang Road, Pudong New Area, Shanghai