Electrical, Electronics & Semiconductors
SEMI-e 2026
深圳国际半导体技术暨应用展览会
Dates
COMPLETED
9–11 Sep 2026
Venue
Shenzhen World Exhibition & Convention Center
Exhibition area
60,000 m²
Exhibitors (expected)
800+
About the show
Semiconductor manufacturing, automotive, consumer electronics, medical and industrial control companies are the sectors SEMI-e serves, and its floor is built to match: design and EDA, wafer fabrication, packaging and testing, the materials and production equipment behind each stage, and the application halls where the parts are used — 5G applications and new displays among them.
Beyond the process blocks, the scope widens into components, displays and Mini/Micro LED, machine vision and sensors, energy storage and power supplies, AI chips and co-packaged optics, millimetre-wave radar and autonomous driving, and automotive-grade semiconductors and packaging. An international pavilion gathers overseas material suppliers, equipment makers, packaging and testing houses and foundries.
What’s on display
Design, chips, wafer fabrication and packaging
- IC design and chips
- Wafer fabrication
- SiP advanced packaging
- Power device packaging and testing
- MEMS packaging and testing
- Silicon wafers and IC packaging substrates
- EDA
- MCU
- Packaging materials, equipment and parts
Semiconductor equipment and parts
- Wafer thinning machines
- Crystal growing furnaces
- Grinding machines
- Thermal processing equipment
- Lithography systems
- Etch systems
- Ion implanters
- CVD and PVD equipment
- Cleaning equipment
- Dicing machines
- Die bonders
- Wire bonders
- Test systems
- Sorters
- Probe stations
- Equipment parts
Advanced materials
- Silicon wafers and silicon-based materials
- Photomasks
- Electronic gases
- Photoresists and ancillary chemicals
- CMP polishing materials
- Sputtering targets
- Packaging substrates
- Lead frames
- Bonding wire
- Ceramic substrates
- Die-attach materials
Third-generation semiconductors
- GaN
- SiC
- ZnO
- Diamond
- Wafers
- Substrates and epiwafers
- Power devices
- IGBT packaging materials
- RF devices
- Processing equipment
IC substrates and ceramic substrates
- IC substrates and packaging processes
- Structural materials including substrates and copper foil
- Chemicals and consumables including dry film and gold salts
- Chiplet packaging
- Memory, MEMS and chip applications
- Packaging materials and equipment
Components
- Passive components
- Discrete semiconductors and IGBTs
- 5G core components
- Power management
- Sensors
- Memory
- Connectors
- Relays
- Cables
- Crystal oscillators
- Resistors
- Displays
- Diodes
- Transistors
- Filter components
- Switches
- Component materials and equipment
Semiconductor displays and Mini/Micro LED
- OLED
- AMOLED
- Mini/Micro LED displays
- Flexible displays
- Display materials and equipment
Machine vision and sensors
- Sensing elements
- Actuators
- Smart sensors
- Industrial sensors
- Sensor chips
- Sensor manufacturing equipment
- Accessories
Power supplies and energy storage
- Energy storage power supplies and sensors
- Battery management chips
- Power semiconductor devices and materials
- Related equipment and instruments
- Instruments and components
AI, computing power, algorithms, storage and CPO
- AI chips and solutions
- Computing chips and solutions
- Algorithm solutions
- Data storage
- Co-packaged optics modules
- Related technologies and equipment
Millimetre-wave radar, LiDAR and autonomous driving
- Millimetre-wave radar modules
- RF chips
- Antennas and high-frequency PCBs
- High-frequency materials
- Production and assembly equipment
- Automotive radar sensor supply chain
Automotive semiconductors and automotive-grade packaging
- Automotive-grade MCUs and computing chips
- Power semiconductors (IGBT and MOSFET)
- Automotive-grade SiC modules
- Power management chips
- Automotive electronics micro-assembly and power devices
- Packaging and testing equipment
- Automation equipment
Microelectronics manufacturing
- Electronics automation
- Machine automation
- Vision inspection
- Environmental protection
- Cleaning equipment
- Inspection equipment
- Test instruments
- Accessories
International pavilion
- International semiconductor material suppliers
- International equipment makers
- Packaging and testing companies
- Foundries
Reference
Conference programme
Five conferences run alongside the show: the 5G and Semiconductor Industry Technology Summit, the International Power Technology Forum, the Third-Generation Semiconductor Industry Development Summit, the TWS Earbud Industry Technology Forum and the AI Summit.
Visitor profile
Delegations come from semiconductor manufacturing, automotive and new energy, consumer electronics, medical and industrial control companies; the 2026 edition was attended by groups from Nexperia, BYD Semiconductor, Foxconn, Huawei, SMIC and other manufacturers and foundries.
Practical information
Organizers
China Communications Industry AssociationShenzhen Semiconductor Industry AssociationShenzhen Zhongxincai Exhibition Co., Ltd.Jiangsu Semiconductor Industry AssociationZhejiang Semiconductor Industry AssociationChengdu Integrated Circuit Industry Association
Opening hours
09:00–17:00 daily, 9–11 September
Visiting address
Shenzhen World Exhibition & Convention CenterNo. 1 Zhancheng Road, Fuhai Street, Bao’an District, Shenzhen