SHIECE, the Shanghai International Electronic Circuit Exhibition, covers the printed circuit board industry chain from base materials to finished assembly. In practice that means rigid, flexible and rigid-flex boards, high-density interconnect boards and IC substrates, together with the processes that produce them: imaging, lamination, CNC and laser drilling, plating, solder-mask printing, surface treatment and inspection. Around that core sit the automation and robotics that move panels between steps, cleanroom, water-treatment and waste-recycling systems, and the laminates, copper foil, dry film, resists and plating chemicals the process consumes. Electronic assembly closes the chain, with stencil printing, component placement, reflow, dispensing, wire bonding and test equipment.

The show is organised in three parts — an exhibition, a summit forum and an academic conference — so that board fabricators, process engineers and the equipment and materials suppliers behind them meet in the same halls.